Cord Master Engineering provides gold cup soldering services to our diverse, global customer base. We follow the latest revisions to global conventions and standards.
Gold Cup Soldering Revision
“Gold and electronics have had a partnership in products and components for many years. The initial reasoning behind the application of gold to printed circuit boards was to make them more susceptible to the application of wire bonding and for corrosion protection. At the time, the gold layer was applied very thickly, typically 50 mils which created numerous soldering quality issues when attaching components to assemblies. It was found that the gold would go into solution and create a thick gold intermetallic condition creating fracture condition in solder joints.”