Cord Master Engineering
1544 Curran Highway
North Adams, MA 01247
Hours: Monday-Friday 8am-5pm

Gold Embrittlement Mitigation

Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. Voiding in SMT solder joints and gold plated components dislodging from the PCB are two well-known failure modes of gold embrittlement. With our J-STD-001 process, we can remove your Gold Embrittlement worries.

Gold Embrittlement Mitigation Warning!

Improper removal of gold on leads prior to pcb assembly can lead to solder cracks/failure.

We comply with the J-STD-001 process:

J-STD-001 criterion. 4.5.1 Gold Removal

Gold Shall Be Removed:

  • From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 μm or more of gold thickness
  • From 95% of all surfaces to be soldered of Surface mount components regardless of gold thickness.
  • From the surfaces to be soldered of Solder terminals plated with 2.54 μm or more of gold thickness.
  • A double tinning process or dynamic solder wave may be used for gold removal prior to soldering the component in the assembly.

We can replace the gold finish with SnPb solder. ROHS compliant solders available, also.

Gold Embrittlement: Quick Turnaround
  • 15 working days
  • Expediting services may be available
Gold Embrittlement: Electrical Components
  • QFP
  • Thru-hole
  • Connectors
  • Resistors
  • Gold Cups
  • DIP
  • SIP
  • SOIC
  • DFN
  • QFN
  • SOD
  • SOT
Gold Embrittlement: Industry Standards
  • ISO 9001:2008
  • AS 9100 REV C
  • MIL Std. 2000
  • J-STD-001 (Space Application Addendum)
  • J-STD-002/004/006/033
  • ANSI/ESD S20.20
  • Mil-I-45208
  • IPC-A-610
  • IPC-WHMA-A-620
Gold Embrittlement: Other Services
  • Solderability Testing
  • Lead forming
  • XRF Scanning
  • Part Marking
  • Kitting
  • Tape and Reel